3M Thermally Conductive Interface Pad, 155 mm L x 210 mm W, Silicon Adhesive, Filled Silicon Polymer Backing, Gray

Product Line: 3M

Length

Width

Thickness

Color

Details

Part#UNI3M06233

Manufacturer:3M

Specifications

Adhesive Material

Silicon

Backing Material

Filled Silicon Polymer

Country of Origin

Dielectric Strength

2 kV/mm

Manufacturer Name

Maximum Operating Temperature

140 deg C

Minimum Operating Temperature

-50 deg C

Specifications Met

ASTM D5470/D6111/D2240/D149/D257

Type

Thermally Conductive

Application

Integrated Chip (IC) Packaging Heat Conduction, Heat Sink Interface, Chip on Film (COF) Heat Conduction, LED Board Thermal Interface Material (TIM), HDTV Integrated Chip (IC), General Gap Filling in Electronic Device

Item Features

Very high thermal conductivity
Hardness - shore 00 = 70
Good softness and conformability even to non-flat surfaces
Slight tack allows pre-assembly
Good wettability for better thermal conductivity
Good dielectric properties
High temperature resistance
Tacky both sides

Standards

CFR 29 1910.1200(b)(6)(v)|TSCA Compliant|UL 94 V-0 Flammability Rating

Documents

Specification Sheet