3M Thermally Conductive Interface Pad, 155 mm L x 210 mm W, Silicon Adhesive, Filled Silicon Polymer Backing, Gray
Pricing Notice
Due to evolving trade policies, product prices may be subject to change. For details, please refer to our Terms of Sale. We remain committed to offering competitive pricing and exceptional service.
Terms of SaleHave a Question About a Product?
Our team is here to answer all your questions and provide the detailed information and support you need to make product decisions.
Contact Us3M Thermally Conductive Interface Pad, 155 mm L x 210 mm W, Silicon Adhesive, Filled Silicon Polymer Backing, Gray
Manufacturer3M
Part #UNI3M06233
Length:
Width:
Thickness:
Color:
Knowledgeable Product TeamBenefit from our experienced team, ready to assist you with expert product knowledge and ensure a seamless shopping experience.
- Manufacturer Name:Â 3MAdhesive Material:Â SiliconBacking Material:Â Filled Silicon PolymerCountry of Origin:Â KRDielectric Strength:Â 2 kV/mmManufacturer Name:Â 3MMaterial Type:Â SiliconeMaximum Operating Temperature:Â 140 deg CMinimum Operating Temperature:Â -50 deg CSeries:Â 5519-10, 5519-15Specifications Met:Â ASTM D5470/D6111/D2240/D149/D257Type:Â Thermally Conductive
- Very high thermal conductivity
- Hardness - shore 00 = 70
- Good softness and conformability even to non-flat surfaces
- Slight tack allows pre-assembly
- Good wettability for better thermal conductivity
- Good dielectric properties
- High temperature resistance
- Tacky both sides
- Integrated Chip (IC) Packaging Heat Conduction, Heat Sink Interface, Chip on Film (COF) Heat Conduction, LED Board Thermal Interface Material (TIM), HDTV Integrated Chip (IC), General Gap Filling in Electronic Device
- CFR 29 1910.1200(b)(6)(v)|TSCA Compliant|UL 94 V-0 Flammability Rating
- Manufacturer Name:Â 3MAdhesive Material:Â SiliconBacking Material:Â Filled Silicon PolymerCountry of Origin:Â KRDielectric Strength:Â 2 kV/mmManufacturer Name:Â 3MMaterial Type:Â SiliconeMaximum Operating Temperature:Â 140 deg CMinimum Operating Temperature:Â -50 deg CSeries:Â 5519-10, 5519-15Specifications Met:Â ASTM D5470/D6111/D2240/D149/D257Type:Â Thermally Conductive
- Very high thermal conductivity
- Hardness - shore 00 = 70
- Good softness and conformability even to non-flat surfaces
- Slight tack allows pre-assembly
- Good wettability for better thermal conductivity
- Good dielectric properties
- High temperature resistance
- Tacky both sides
- Integrated Chip (IC) Packaging Heat Conduction, Heat Sink Interface, Chip on Film (COF) Heat Conduction, LED Board Thermal Interface Material (TIM), HDTV Integrated Chip (IC), General Gap Filling in Electronic Device
- CFR 29 1910.1200(b)(6)(v)|TSCA Compliant|UL 94 V-0 Flammability Rating
Pricing Notice
Due to evolving trade policies, product prices may be subject to change. For details, please refer to our Terms of Sale. We remain committed to offering competitive pricing and exceptional service.
Terms of SaleHave a Question About a Product?
Our team is here to answer all your questions and provide the detailed information and support you need to make product decisions.
Contact Us3M3M Thermally Conductive Interface Pad, 155 mm L x 210 mm W, Silicon Adhesive, Filled Silicon Polymer Backing, Gray
Part #:UNI3M06233