3M 7000046513 3762 LM Q Hot Melt Adhesive, Tan, 1 in L, 130 deg F
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Due to evolving trade policies, product prices may be subject to change. For details, please refer to our Terms of Sale. We remain committed to offering competitive pricing and exceptional service.
3M 7000046513 3762 LM Q Hot Melt Adhesive, Tan, 1 in L, 130 deg F
Manufacturer3M
Part #801182614
MFG #62-3762-9330-4
UPC #021200826146
3M, 7000046513, Hot Melt Adhesive, Series: 3762 LM Q, 1 in Length, Bonds To: Wood/Particle Board/Chipboard/Foam, 130 deg F, Tan
$ / CS
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Manufacturer Name: 3M
Application Time: 35 s
Bonds To: Chipboard, Foam, Paper, Uncoated Cardboard and Wood
Color: Tan
Country of Origin: US
Curing Time: 24 hr
Diameter: 1 in
Length: 1 in, 3 in
Manufacturer Name: 3M
Series: 3762 LM Q
Temperature Rating: -20 to 150 deg F, 130 deg F
Aggressive hot tack rapidly achieves handling strength
Short open time allows for fast assembly lines
Securely bonds difficult to seal substrates such as lightly waxed surfaces
Low viscosity prevents stringing even at fast production speeds
Recommended application temperature range - 350-385F (177-196C)
3M Hot Melt Adhesive 3762 is a 100% solids, fast-setting hot melt adhesive designed for packaging and shipping applications. It is ideal for bonding corrugated fiberboard cartons, wood, particle board, chipboard and foam. The recommended application temperature range is 350-385°F (177-196°C)
Bonds To: Chipboard, Foam, Paper, Uncoated Cardboard and Wood
Color: Tan
Country of Origin: US
Curing Time: 24 hr
Diameter: 1 in
Length: 1 in, 3 in
Manufacturer Name: 3M
Series: 3762 LM Q
Temperature Rating: -20 to 150 deg F, 130 deg F
Aggressive hot tack rapidly achieves handling strength
Short open time allows for fast assembly lines
Securely bonds difficult to seal substrates such as lightly waxed surfaces
Low viscosity prevents stringing even at fast production speeds
Recommended application temperature range - 350-385F (177-196C)
3M Hot Melt Adhesive 3762 is a 100% solids, fast-setting hot melt adhesive designed for packaging and shipping applications. It is ideal for bonding corrugated fiberboard cartons, wood, particle board, chipboard and foam. The recommended application temperature range is 350-385°F (177-196°C)
Due to evolving trade policies, product prices may be subject to change. For details, please refer to our Terms of Sale. We remain committed to offering competitive pricing and exceptional service.