3M 5114141468 Wafer DeTaping Tape, 100 m L x 25 mm W, 0.068 mm THK, Polyester, Rubber Adhesive, Silicon Backing

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Due to evolving trade policies, product prices may be subject to change. For details, please refer to our Terms of Sale. We remain committed to offering competitive pricing and exceptional service.

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3M 5114141468 Wafer DeTaping Tape, 100 m L x 25 mm W, 0.068 mm THK, Polyester, Rubber Adhesive, Silicon Backing

Manufacturer3M

Part #114141468

MFG #7010321285

UPC #051141414683

3M, 5114141468, DeTaping Tape, Wafer, 100 m Length, 25 mm Width, 0.068 mm Thickness, Polyester, Rubber Adhesive, Silicon Backing, 9.41 N-cm Adhesion Strength, 78.4 N-cm Tensile Strength

$46.94

/ RL

QTY

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Manufacturer Name: 3M

Adhesion Strength: 9.41 N-cm

Adhesive Material: Rubber

Backing Material: Silicon

Country of Origin: JP

Length: 100 m

Manufacturer Name: 3M

Material Type: Polyester

Tensile Strength: 78.4 N-cm

Thickness: 0.068 mm

Type: Wafer De-Taping

Width: 25 mm

A transparent polyester film tape with an aggressive rubber adhesive specifically designed for the removal of silicon wafer back grinding tape
Enables simple, low stress, room temperature peeling of 3M adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power

3M, 5114141468, DeTaping Tape, Wafer, 100 m Length, 25 mm Width, 0.068 mm Thickness, Polyester, Rubber Adhesive, Silicon Backing, 9.41 N-cm Adhesion Strength, 78.4 N-cm Tensile Strength

ECCN EAR99

Manufacturer Name: 3M

Adhesion Strength: 9.41 N-cm

Adhesive Material: Rubber

Backing Material: Silicon

Country of Origin: JP

Length: 100 m

Manufacturer Name: 3M

Material Type: Polyester

Tensile Strength: 78.4 N-cm

Thickness: 0.068 mm

Type: Wafer De-Taping

Width: 25 mm

A transparent polyester film tape with an aggressive rubber adhesive specifically designed for the removal of silicon wafer back grinding tape
Enables simple, low stress, room temperature peeling of 3M adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power

3M, 5114141468, DeTaping Tape, Wafer, 100 m Length, 25 mm Width, 0.068 mm Thickness, Polyester, Rubber Adhesive, Silicon Backing, 9.41 N-cm Adhesion Strength, 78.4 N-cm Tensile Strength

ECCN EAR99

Pricing Notice

Due to evolving trade policies, product prices may be subject to change. For details, please refer to our Terms of Sale. We remain committed to offering competitive pricing and exceptional service.

Terms of Sale

Have a Question About a Product?

Our team is here to answer all your questions and provide the detailed information and support you need to make product decisions.

3M3M 5114141468 Wafer DeTaping Tape, 100 m L x 25 mm W, 0.068 mm THK, Polyester, Rubber Adhesive, Silicon Backing

Part #:114141468

MFG #:7010321285

$46.94

/ RL

QTY