3M 5114141468 Wafer DeTaping Tape, 100 m L x 25 mm W, 0.068 mm THK, Polyester, Rubber Adhesive, Silicon Backing

Product Line: 3M

MFG #: 7010321285

Your Price

$46.94 / RL

Pack: 1/RL

Qty

Details

Part#114141468

Manufacturer:3M

UPC:051141414683

MFG #7010321285

3M, 5114141468, DeTaping Tape, Wafer, 100 m Length, 25 mm Width, 0.068 mm Thickness, Polyester, Rubber Adhesive, Silicon Backing, 9.41 N-cm Adhesion Strength, 78.4 N-cm Tensile Strength

Specifications

Adhesion Strength

9.41 N-cm

Adhesive Material

Rubber

Backing Material

Silicon

Country of Origin

Length

100 m

Manufacturer Name

Material Type

Polyester

Tensile Strength

78.4 N-cm

Thickness

0.068 mm

Type

Wafer De-Taping

Width

25 mm

Application

Electronics Applications

Item Features

A transparent polyester film tape with an aggressive rubber adhesive specifically designed for the removal of silicon wafer back grinding tape
Enables simple, low stress, room temperature peeling of 3M adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power

Standards

ECCN EAR99